Good news for all fans, the ASUS and Bandai partnership was not limited to a single collection of products, and now the former offers a Z590 WIFI GUNDAM EDITION on its site. A card that offers itself a new look compared to the Z490, with perhaps a little more colors, more logically different shapes for the radiators. That of the chipset also offers a decoration that refers directly to the head of the RX-78-2, a nice little nod.
In terms of technical characteristics, this Z590 WIFI GUNDAM EDITION is complete with a Thunderbolt 4 port, three M.2 slots, WiFi 6, a sixteen-phase power supply stage, a 2.5 GbE Ethernet port, etc. In short, a nicely revamped TUF GAMING Z590-PLUS WIFI can be discovered here.
Intel® Z590 (LGA 1200) ATX gaming motherboard with 16 DrMOS power stages, PCIe® 4.0, three M.2 slots, Intel® WiFi 6 and 2.5 Gb Ethernet, HDMI®, DisplayPort™, USB 3.2 Gen 2x2 Type-C®, SATA 6 Gbps, front panel USB 3.2 Gen 1 Type‑C®, Thunderbolt™ 4 support and Aura Sync RGB lighting
- Intel® LGA 1200 socket: Ready for 11th and 10th Gen Intel® Core™ processors
- Enhanced power solution: 14+2 DrMOS power stages, six-layer PCB, ProCool sockets, military-grade components and Digi+ VRM for maximum durability
- Comprehensive cooling: Enlarged VRM heatsink, PCH fanless heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4 utility
- Next-gen connectivity: PCIe® 4.0, USB 3.2 Gen 2x2 Type-C®, front panel header for USB 3.2 Gen 1 Type-C® and Thunderbolt 4™ support
- Made for online gaming: Intel® WiFi 6, Intel® 2.5 Gb Ethernet, LANGuard and TurboLAN technology
- Two-way AI Noise Cancelation: Reduces background noise from the microphone and audio output for crystal-clear communication in games or video conferences
- Realtek S1200A codec: Pristine audio quality with unprecedented 108 dB signal-to-noise ratio for stereo line out and 103 dB SNR for line in
Durable | Stable | Reliable.
Decked out in the heroic white livery worn by the RX-78-2 of the Mobile Suit GUNDAM anime series, ASUS Z590 WIFI GUNDAM EDITION is a special-edition motherboard that propels the latest Intel® platform to new heights with game-ready features and proven durability. Engineered with the precision one expects from the Earth Federation Space Force and employing top-grade components as well as an upgraded power solution and comprehensive cooling options, this motherboard delivers rock-solid performance with unwavering stability.
Cooler by Design
- 1.6X larger VRM heatsink: The extensive surface area of the large, high-mass heatsink covers the VRM and choke to improve heat dissipation. The total surface area of the VRM heatsink is 1.6X that of the previous generation.
- Thermal Pads: High-quality thermal pads help transfer heat from the inductor and phase array to the heatsink.
- Three M.2 slots with heatsinks: Each M.2 slot has a dedicated heatsink keep the M.2 SSDs at optimum operating temperature to ensure consistent performance and reliability.
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